XML Codes Gallery for the Manchester Thermal Analyzer
Synthetic Linear Benchmark
Date: 01-09-2017
Submitted by: Y.-C. Chen, S. Ladenheim, M. Mihajlović, and
V.F. Pavlidis, School of Computer Science, University of Manchester
Description:
This synthetic linear benchmark was originally created for validation of the MTA with COMSOL. The geometry consists of two silicon tiers, a heat spreader, and solid heat sink.
Submitted by: Y.-C. Chen, S. Ladenheim, M. Mihajlović, and
V.F. Pavlidis, School of Computer Science, University of Manchester
Description:
This synthetic nonlinear benchmark was originally created to demonstrate a nonlinear thermal simulation. The geometry consists of two active silicon tiers divided into four cores, a heat spreader, and a heat sink with fins.
Submitted by: Y.-C. Chen, S. Ladenheim, M. Mihajlović, and
V.F. Pavlidis, School of Computer Science, University of Manchester
Description:
The ev6 3D was originally created by researchers at Boston University. It also belongs to the Hotspot 6.0 suite. It has been adapted to the MTA by enabling the -lcf conversion flag in the run_flow.pl.
Submitted by: Y.-C. Chen, S. Ladenheim, M. Mihajlović, and
V.F. Pavlidis, School of Computer Science, University of Manchester
Description:
The figures show Intel quad-core Nehalem microarchitecture CPU in 45nm technology, FCLGA1366 package, and a copper heat sink.
The package is designed for CPUs of maximum 130W power consumption.
The geometry of the package and heat sink are based on Intel's thermal guide for Xeon 5500/5600 series.
S. Ladenheim, Y.-C. Chen, M. Mihajlović, and V.F. Pavlidis,
"IC Thermal Analyzer for Versatile 3-D Structures Using Multigrid Preconditioned Krylov
Methods," in IEEE International Conference on Computer Aided Design (ICCAD), 2016